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 AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Features
* * * * * * * * * * Wide input voltage range: 1.5V - 6V Low RDS(ON): 80m typical @ 5V Turn-on slew rate controlled AP2280-1: 100us turn-on rise time AP2280-2: 1ms turn-on rise time Very low turn-on quiescent current: << 1uA Fast load discharge pin Temperature range -40C to 85C Green Package: SOT25 SOT25: Available in "Green" Molding Compound (No Br, Sb) (Note 1)
Description
The AP2280 slew rate controlled load switch is a single P-channel MOSFET power switch designed for high-side load-switching or power distribution applications. The MOSFET has a typical RDS(ON) of 80m at 5V, allowing increased load current handling capability with a low forward voltage drop. The turn-on slew rate of the device is controlled internally to reduce turn-on inrush current. The AP2280 load switch is designed to operate from 1.5V to 6.0V, making it ideal for 1.8V, 2.5V, 3.3V, and 5V systems. The typical quiescent supply current is only 0.004uA, making it ideal for battery powered distribution systems where power consumption is a concern.
Applications
* * * * * * * Smart Phones Personal Digital Assistant (PDA) Cell Phones GPS Navigators Bluetooth Headsets PMP/MP4 Notebook and Pocket PC
Ordering Information
AP2280 - X X X X
Turn-on rise time 1 : 100us 2 : 1ms
Note:
Package W : SOT25
Lead Free G : Green
Packing -7 : Taping & Reel
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
Device AP2280-1W AP2280-2W
Note:
Package Code W W
Packaging (Note 2) SOT25 SOT25
7" Tape and Reel Quantity Part Number Suffix 3000/Tape & Reel -7 3000/Tape & Reel -7
2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
AP2280 Rev. 2
1 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Pin Assignments
( Top View ) DIS 1 GND 2 OUT 3 SOT25 4 IN 5 EN
Pin Description
Pin Number SOT25 1 2 3 4 5 Discharge pin. If DIS pin is tied to OUT pin externally, the output voltage will be discharged to ground when disabled. Ground. Voltage output pin. This is the pin to the P-channel MOSFET drain. Bypass to ground through a 0.1uF capacitor. Voltage input pin. This is the pin to the P-channel MOSFET source. Bypass to ground through a 1F capacitor. Enable input, active high. Description
Pin Name DIS GND OUT IN EN
AP2280 Rev. 2
2 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Block Diagram
Typical Application Circuits
V IN
IN O UT D IS 1uF Enable 0.1uF EN G ND 1uF Enable EN G ND
V OUT
V IN
IN OUT D IS
V OUT
0.1uF
For applications without output discharge
For applications with output discharge
Absolute Maximum Ratings
Symbol ESD HBM ESD MM VIN VOUT VEN Iload TJ(max) TST PD Parameter Human Body Model ESD Protection Machine Model ESD Protection Input Voltage Output Voltage Enable Voltage Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range Power Dissipation (Note 3,5) SOT25 Ratings 4 400 6.5 VIN + 0.3 6.5 2 125 -65 ~ 150 750 Units KV V V V V A C C mW
Note: 3. Ratings apply to ambient temperature at 25C.
AP2280 Rev. 2
3 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Recommended Operating Conditions
Symbol VIN IOUT TA
Note:
Parameter Input voltage Output Current (Note 4) Operating Ambient Temperature
Min 1.5 0 -40
Max 6.0 2.0 85
Units V A C
4. Maximum output current depends on application conditions. Please refer to the application note section.
Electrical Characteristics
(TA = 25 C, VIN = VEN = 5.0V, unless otherwise stated) Symbol Parameters Input Quiescent Current IQ Input Shutdown Current ISHDN Input Leakage Current ILEAK RDS(ON) VIL VIH ISINK TD(ON) TON TD(OFF) RDISCH JA JC
Note:
o
Switch on-resistance EN Input Logic Low Voltage EN Input Logic High Voltage EN Input leakage Output turn-on delay time Output turn-on rise time Output turn-off delay time Discharge FET on-resistance Thermal Resistance Junction-to-Ambient Thermal Resistance Junction-to-Case
Test Conditions VEN = VIN, IOUT = 0 VEN = 0V, OUT open VEN = 0V, OUT grounded VIN = 5.0V VIN = 3.3V VIN = 1.8V VIN = 1.5V VIN = 1.5V to 6V VIN > 2.7V VIN = 1.5V to 2.7V VEN = 5V Rload=10 AP2280-1, Rload = 10 AP2280-2, Rload = 10 Rload = 10 VEN = GND SOT25 (Note 5) SOT25 (Note 5)
Min
Typ. Max 0.004 1 0.004 1 0.01 1 80 92 150 200 0.4
2.0 1.4
Unit A A A m m m m V V V 1 A 1 S 100 150 S 1000 1500 S 0.4 1 S 20 40 o 160 C/W o 38 C/W
5. Test condition for SOT25: Device mounted on FR-4 substrate PC board, with minimum recommended pad layout.
AP2280 Rev. 2
4 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
Quiescent Current vs. Input Voltage
0.01
0.020
Quiescent Current vs. Temperature
Quiescent Current (A)
Quiescent Current (A)
VIN=1.8V VIN=3.3V 0.015 VIN=5.0V
0.008
0.006
0.010
0.004
0.002
0.005
0 1.0 2.0 3.0 4.0 5.0 6.0
0.000 -40 -20 0 20 40 60 80 100
Input Voltage (V)
Temperature (C)
RDS(ON) vs. Input Voltage
300.00
200.00
RDS(ON) vs. Temperature
I=100mA
250.00
180.00 160.00
I=500mA
RDS(ON) (m)
RDS(ON) (m)
I=1A I=2A
200.00
140.00 120.00 100.00 80.00 60.00
150.00
VIN =1.8V
40.00 20.00
100.00
VIN =3.3V VIN =5V
-50 -25 0 25 50 75 100
50.00 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
0.00
Input Voltage (V)
Temperature (C)
ENABLE Threshold vs. Input Voltage
1.8
Input Shutdown Current vs. Temperature
0.010
VIN=5V
ON/OFF Threshold (V)
1.6
0.008
ISHDN (A)
VIL (V) VIH (V)
1.4 1.2 1 0.8
0.006
0.004
0.002
0.6 0.4 1.5 2 2.5 3 3.5 4 4.5
0.000
5 5.5
-40
-20
0
20
40
60
80
100
Input Voltage (V)
Temperature (C)
AP2280 Rev. 2
5 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
AP2280-1 Turn-On
(VIN=3.3V, RL=7)
(Continued)
AP2280-1 Turn-Off
(VIN=3.3V, RL=7)
VEN (2V/div)
VEN (2V/div)
VOUT (2V/div)
VOUT (2V/div)
IIN (500mA/div) IIN (500mA/div)
Time (50s/div)
Time (5s/div)
AP2280-1 Turn-On
(VIN=5V, RL=10)
VEN (2V/div) VEN (2V/div)
AP2280-1 Turn-Off
(VIN=5V, RL=10)
VOUT (2V/div) VOUT (2V/div)
IIN (500mA/div)
IIN (500mA/div)
Time (50s/div)
Time (5s/div)
AP2280 Rev. 2
6 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Typical Performance Characteristics
AP2280-2 Turn-On
(VIN=3.3V, RL=7)
(Continued)
AP2280-2 Turn-Off
(VIN=3.3V, RL=7)
VEN (2V/div)
VEN (2V/div)
VOUT (2V/div) VOUT (2V/div)
IIN (500mA/div) IIN (500mA/div)
Time (500s/div)
Time (5s/div)
AP2280-2 Turn-On
(VIN=5V, RL=10)
VEN (2V/div) VEN (2V/div)
AP2280-2 Turn-Off
(VIN=5V, RL=10)
VOUT (2V/div) VOUT (2V/div)
IIN (200mA/div) IIN (500mA/div)
Time (500s/div)
Time (5s/div)
AP2280 Rev. 2
7 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Application Note
Input Capacitor A 1F capacitor is recommended to connect between IN and GND pins to decouple input power supply glitch and noise. The input capacitor has no specific type or ESR (Equivalent Series Resistance) requirement. However, for higher current application, ceramic capacitors are recommended due to their capability to withstand input current surges from low impedance sources, such as batteries in portable applications. This input capacitor must be located as close as possible to the device to assure input stability and less noise. For PCB layout, a wide copper trace is required for both IN and GND. Output Capacitor A 0.1F capacitor is recommended to connect between OUT and GND pins to stabilize and accommodate load transient condition. The output capacitor has no specific type or ESR requirement. The amount of the capacitance may be increased without limit. For PCB layout, the output capacitor must be placed as close as possible to OUT and GND pins, and keep the traces as short as possible. Enable/Shutdown Operation The AP2280 is turned on by setting the EN pin high and is turned off by pulling it low. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. Discharge Operation The AP2280 offers a discharge option that helps to discharge the output when disabled. To use this feature, the DIS pin is connected to the OUT pin externally. If this feature is not used, the DIS pin should be left open. Power Dissipation The device power dissipation and proper sizing of the thermal plane is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by:
PD = IOUT xR DSON
2
(1)
However, the maximum power dissipation that can be handled by the device depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be approximated by the equation below:
PD (max@ TA ) =
( +125C - TA ) (2) JA
For example at VIN = 5V, the typical RDSON = 80m. For IOUT = 2A, the maximum power dissipation calculated using equation (1) is PD = 0.32W. Based on JA = 160C/W and equation (2), the calculated junction temperature rise from ambient is approximately 51C. Since the maximum junction temperature is 125C, the operating ambient temperature must be kept below 74C to safely operate the device. On the other hand, at TA = 85C and VIN = 5V, the calculated maximum power dissipation from equation (2) is PDmax = 0.25W. Hence the safe operating maximum continuous current is 1.77A. For other application conditions, the users should recalculate the device maximum power dissipation based on the operating conditions.
AP2280 Rev. 2
8 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated
AP2280
SINGLE CHANNEL SLEW RATE CONTROLLED LOAD SWITCH
Marking Information
( Top View )
5
4
7
XX Y M X
XX : UA : AP2280-1 UB : AP2280-2 Y : Year 0~9 M : Month A~L X : G : Green
1
2
SOT25
3
Package Information
(All Dimensions in mm)
IMPORTANT NOTICE Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages. LIFE SUPPORT Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.
AP2280 Rev. 2
9 of 9 www.diodes.com
OCTOBER 2007
(c) Diodes Incorporated


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